Resin.io Secures $9,000,000 Series B Round

  • Feed Type
  • Date
    6/27/2016
  • Company Name
    Resin.io
  • Mailing Address
    1517 12th Avenue Seattle, WA 98122 USA
  • Company Description
    Smart locks, home hubs, or local gateways for swarms of sensors, are all becoming Linux devices. Having end-users return devices for update or visiting their homes is a non-starter. As such, the power to seamlessly update the devices and keep delivering an up-to date experience allows products to evolve fast and lean, even after having considerable installed bases.
  • Website
    http://www.resin.io
  • Transaction Type
    Venture Equity
  • Transaction Amount
    $9,000,000
  • Transaction Round
    Series B
  • Proceeds Purposes
    The new round of funding will be used to expand the company’s product footprint, grow its open source community, and broaden its global reach through new strategic partnerships and channels.
  • M&A Terms
  • Venture Investor
    DFJ
  • Venture Investor
    GE Ventures
  • Venture Investor
    Ericsson Venture Partners
  • Venture Investor
    Aspect Ventures

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