Rayspan Obtains $12,500,000 Series B Funding Round

  • Feed Type
  • Date
  • Company Name
  • Mailing Address
    11975 El Camino Real San Diego, CA 92130-2543
  • Company Description
    Rayspan Corporation is the world’s leading innovator of revolutionary metamaterial air interface solutions for high performance wireless communication networks. Metamaterials are emerging as the most important advance in air interface technology in decades. They exhibit electromagnetic properties not found in natural media that enable breakthrough improvements in communication system performance.
  • Website
  • Transaction Type
    Venture Equity
  • Transaction Amount
  • Transaction Round
    Series B
  • Proceeds Purposes
    Proceeds purposes were not disclosed.
  • M&A Terms
  • Venture Investor
    Sequoia Capital
  • Venture Investor
    Khosla Ventures

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