LendKey Garners $5,000,000 New Round

  • Feed Type
  • Date
  • Company Name
  • Mailing Address
    104 W. 27th St. 4th Floor New York, NY 10001 USA
  • Company Description
    LendKey offers cloud-based technology to provide the essential infrastructure for financial institutions or any party to quickly, securely, efficiently, and profitably lend to anyone else – from those offering loans directly to those structuring new types of loans.
  • Website
  • Transaction Type
  • Transaction Amount
  • Transaction Round
  • Proceeds Purposes
    Proceeds purposes were not disclosed. 5 investors participated in the offering. The amount may include options, warrants or other securities. Contact technology company for investment details, if applicable. Not an offer or solicitation for the sale of securities or debt. SEC regulatory filing.
  • M&A Terms
  • Venture Investor

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