NexPlanar Receives $5,000,000 New Funding Round

  • Feed Type
  • Date
    6/27/2013
  • Company Name
    NexPlanar
  • Mailing Address
    7175 NW Evergreen Parkway Hillsboro, OR 97124
  • Company Description
    NexPlanar builds the next generation of chemical mechanical planarization (CMP) pads for the semiconductor device industry. Our propriety nano-domain technology coupled with patented molded grooves and the unique ability to tune the pads results in dramatically improved yields and lower cost of ownership with extended pad life.
  • Website
    http://www.nexplanar.com
  • Transaction Type
    Debt
  • Transaction Amount
    $5,000,000
  • Transaction Round
    Undisclosed
  • Proceeds Purposes
    The funds provided under the venture loan facility will be used for working capital purposes.
  • M&A Terms
  • Venture Investor
    Horizon Technology Finance

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