NexPlanar Secures $10,000,000 New Funding
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Feed Type
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Link
http://www.venturedeal.com/Search/SearchResultTransactionDetail.aspx?TransactionId=d6bffbf7-5565-4812-b20d-8ea717d65c9e&Preview=1 -
Date
1/4/2013 -
Company Name
NexPlanar -
Mailing Address
7175 NW Evergreen Parkway Hillsboro, OR 97124 -
Company Description
NexPlanar builds the next generation of chemical mechanical planarization (CMP) pads for the semiconductor device industry. Our propriety nano-domain technology coupled with patented molded grooves and the unique ability to tune the pads results in dramatically improved yields and lower cost of ownership with extended pad life. -
Website
http://www.nexplanar.com -
Transaction Type
Venture Equity -
Transaction Amount
$10,000,000 -
Transaction Round
Undisclosed -
Proceeds Purposes
Proceeds purposes were not disclosed. SEC regulatory filing. -
M&A Terms
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Venture Investor
Undisclosed
