NexPlanar Corporation Secures $14,500,000 New Funding Round
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Feed Type
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Link
http://www.venturedeal.com/Search/SearchResultTransactionDetail.aspx?TransactionId=fd63c741-5b9d-4764-b3d2-e0dce96989e8&Preview=1 -
Date
7/10/2008 -
Company Name
NexPlanar Corporation -
Mailing Address
7425 NW Evergreen Parkway Hillsboro, OR 97124 -
Company Description
NexPlanar builds the next generation of chemical mechanical planarization (CMP) pads for the semiconductor device industry. Our propriety nano-domain technology coupled with patented molded grooves and the unique ability to tune the pads results in dramatically improved yields and lower cost of ownership with extended pad life. -
Website
http://www.nexplanar.com -
Transaction Type
Venture Equity -
Transaction Amount
$14,500,000 -
Transaction Round
Undisclosed -
Proceeds Purposes
Proceeds purposes were not disclosed. -
M&A Terms
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Venture Investor
InterWest Partners -
Venture Investor
BlueRun Ventures -
Venture Investor
SmartForest Ventures -
Venture Investor
Finaventures -
Venture Investor
Intel Capital
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