NeoPad Technologies Corp. Lands $14,000,000 Series C Round

  • Feed Type
  • Date
    6/27/2008
  • Company Name
    NeoPad Technologies Corp.
  • Mailing Address
    7425 NW Evergreen Parkway Hillsboro, OR 97124
  • Company Description
    Neopad Technologies Corporation offers specific application CMP pad technology to meet the challenging CMP polishing performance requirements for next generation IC and HDD designs. Our innovative solo pad design provides significant performance advantages which leads to improved yields and lower cost of ownership savings to our customers. Neopad Technologies has established a very strong management and application team to support our customers in providing a totally integrated polishing solution. The company has established several strategic partnerships in both technology and manufacturing and is backed by a very strong and committed group of investors.
  • Website
    http://www.neopadtech.com
  • Transaction Type
    Venture Equity
  • Transaction Amount
    $14,000,000
  • Transaction Round
    Series C
  • Proceeds Purposes
    Proceeds purposes were not disclosed.
  • M&A Terms
  • Venture Investor
    InterWest Partners
  • Venture Investor
    BlueRun Ventures
  • Venture Investor
    Intel Capital
  • Venture Investor
    SmartForest Ventures

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