Bump Technologies Secures $16,000,000 Series B Financing Round

  • Feed Type
  • Date
    1/11/2011
  • Company Name
    Bump Technologies
  • Mailing Address
    Undisclosed Mountain View, CA 94041
  • Company Description
    Bump is a quick and easy way to connect two phones by simply bumping them together. Exchange your phone number, photos, or compare friends with just a bump.
  • Website
    http://www.bumptechnologies.com
  • Transaction Type
    Venture Equity
  • Transaction Amount
    $16,000,000
  • Transaction Round
    Series B
  • Proceeds Purposes
    This round of financing solidifies our priorities to build a world-class engineering and product organization here in Silicon Valley.
  • M&A Terms
  • Venture Investor
    Andreessen Horowitz
  • Venture Investor
    Sequoia Capital
  • Venture Investor
    Sherpalo Ventures
  • Venture Investor
    SV Angel

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