Bump Technologies Secures $16,000,000 Series B Financing Round
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Feed Type
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Link
http://www.venturedeal.com/Search/SearchResultTransactionDetail.aspx?TransactionId=6e3d08e2-b5ef-4699-866c-7d2b5817b6ac&Preview=1 -
Date
1/11/2011 -
Company Name
Bump Technologies -
Mailing Address
Undisclosed Mountain View, CA 94041 -
Company Description
Bump is a quick and easy way to connect two phones by simply bumping them together. Exchange your phone number, photos, or compare friends with just a bump. -
Website
http://www.bumptechnologies.com -
Transaction Type
Venture Equity -
Transaction Amount
$16,000,000 -
Transaction Round
Series B -
Proceeds Purposes
This round of financing solidifies our priorities to build a world-class engineering and product organization here in Silicon Valley. -
M&A Terms
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Venture Investor
Andreessen Horowitz -
Venture Investor
Sequoia Capital -
Venture Investor
Sherpalo Ventures -
Venture Investor
SV Angel
