Tela Innovations Lands $5,500,000 Series C Round
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Feed Type
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Link
http://www.venturedeal.com/Search/SearchResultTransactionDetail.aspx?TransactionId=68308855-52a0-4066-9749-5a7a7dd60106&Preview=1 -
Date
12/17/2008 -
Company Name
Tela Innovations -
Mailing Address
655 Campbell Technology Parkway Campbell, CA 95008-5061 -
Company Description
Tela Innovations offers a next-generation solution for designing advanced semiconductors in the ‘sub wavelength,’ low k 1 era – 45nm and beyond. The Tela solution uses on-grid, straight line, one dimensional layout structures to produce a lithography-optimized layout. The result of using Tela’s pre-defined, predictable topologies is significant improvements in variability, performance, leakage and area. -
Website
http://www.tela-inc.com -
Transaction Type
Venture Equity -
Transaction Amount
$5,500,000 -
Transaction Round
Series C -
Proceeds Purposes
The company plans to use the money to commercialize its semiconductor designs, aimed at efficiently scaling their processes. -
M&A Terms
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Venture Investor
Cadence Design Systems -
Venture Investor
KT Venture Group -
Venture Investor
Qualcomm, Inc.
